TO-236 ITT Intermetall
>NAME
>VALUE
TO-236 ITT Intermetall
Courtesy: Adafruit Industries
>NAME
>VALUE
>NAME
>VALUE
3.2" 240x320
TFT LCD Display
50
1
XL
XR
YU
YD
>NAME
>VALUE
Suggested Cutout Zone
>NAME
>VALUE
<b>Plastic Quad Flat Non-leaded package</b> 64 pins, 9 × 9 × 0.85 mm³, 0.5 mm pitch<p>
Source: https://www.micronas.com .. mas35x9f_3ds.pdf
>NAME
>VALUE
>NAME
>VALUE
<b>Small Outline Transistor</b> - 5 Pin
>NAME
>VALUE
>NAME
E
C
>NAME
>VALUE
A
C
>NAME
>VALUE
>Name
>Value
4 Pin JST PH Series Female Connector<br/>
Righ-Angle SMT
>Name
>Value
>NAME
>VALUE
1
3
<b>SOD323</b> (2.5x1.2mm)
>NAME
>VALUE
<p>4UCon: 20317</p>
>NAME
>VALUE
PCB EDGE
>NAME
>VALUE
1206 (3216 Metric)
>NAME
>VALUE
<b>Small Outline IC - 208mil Wide</b>
>NAME
>VALUE
>NAME
>VALUE
<b>Small Outline IC - 150mil Wide</b>
>NAME
>VALUE
>VALUE
>NAME
<b>Small Outline Transistor</b> - 6 Pin
>NAME
>VALUE
>NAME
>VALUE
1
>NAME
>VALUE
>NAME
>VALUE
<b>Test Pins/Pads</b><p>
Cream on SMD OFF.<br>
new: Attribute TP_SIGNAL_NAME<br>
<author>Created by librarian@cadsoft.de</author>
<b>TEST PAD</b>
>NAME
>VALUE
>TP_SIGNAL_NAME
TEST PAD
<b>Small Outline Transistor</b><p>
package type OT
>NAME
>VALUE
<b>EAGLE Design Rules</b>
<p>
Die Standard-Design-Rules sind so gewählt, dass sie für
die meisten Anwendungen passen. Sollte ihre Platine
besondere Anforderungen haben, treffen Sie die erforderlichen
Einstellungen hier und speichern die Design Rules unter
einem neuen Namen ab.
<b>Adafruit board design rules</b>
<p>
<ul>
<li>Smallest drill: 16mm</li>
<li>Min trace: 10mil</li>
<li>Min spacing: 8mil</li>
<li>Dimension spacing: 10mil</li>
<li>Tenting for vias</li>
<li>Angle check on</li>
</ul>
Since Version 8.2, EAGLE supports online libraries. The ids
of those online libraries will not be understood (or retained)
with this version.
Since Version 8.3, EAGLE supports URNs for individual library
assets (packages, symbols, and devices). The URNs of those assets
will not be understood (or retained) with this version.
Since Version 8.3, EAGLE supports the association of 3D packages
with devices in libraries, schematics, and board files. Those 3D
packages will not be understood (or retained) with this version.